KUALA LUMPUR: QDOS Holdings Bhd (QDOS), a pioneer manufacturer of flexible printed circuits, is undertaking investments worth RM35mil to develop first-of-its-kind semiconductor technology in Malaysia.
This technology developed by the company is known as Molded Interconnect Substrates (MIS), that provides an innovative interposes solution in Ball Grid Arrays (BGA), Quad Flat No-lead (QFN) and fine pitch flip-chip semiconductor packaging.
QDOS business development director S.Suresh said to-date, the company has undertaken investments of RM25mil for equipment, manpower and technology transfer activities to develop this technology.
He expects that the company would undertake investments of another RM10mil more this year to manufacture the MIS circuits.
Suresh noted that the raw materials to develop this technology would allow the company to position it as a cost competitive solution, which nudges the semiconductor industry to take the leap forward within Malaysia and Southeast Asia region.
The company would be unveiling the MIS technology from 22-24 April 2015 at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang.
“Along with the MIS technology, we will also be showcasing FPCs for IoT applications,” Suresh concluded.
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