BSL Corp unit secures RM14.58m contract from SDU


KUALA LUMPUR: BSL Corporation Bhd’s unit Ban Seng Lee Industries Sdn Bhd has secured a US$3.5m (RM14.58mil) contract from SDU Pte Ltd to fabricate and supply semiconductor components, sub-assembly modules.

BSL Corp executive director Brian Hoo Wai Keong said the contract involved manufacturing and suppling a total US$3.5mil worth of integrated console, sheetmetal fabrication including precision machining.

Subscribe or renew your subscriptions to win prizes worth up to RM68,000!

Monthly Plan

RM13.90/month

Annual Plan

RM12.33/month

Billed as RM148.00/year

1 month

Free Trial

For new subscribers only


Cancel anytime. No ads. Auto-renewal. Unlimited access to the web and app. Personalised features. Members rewards.

SDU Pte , BSL , precision machining

   

Next In Business News

Decarbonising cement: Are we ready?
After a homeowner passes
A stinky nuisance: When septic tanks burst
Ringgit to trade in tight range of 4.46-4.48 versus US dollar next week
Building a firm facade
Portfolio positioning under Trump era
EQ expands to Thailand
RHB, CGC in LCTF portfolio guarantee deal
Market struggles to find direction
Sapura Energy ‘in a good place now’

Others Also Read