Japanese chip sector firms are continuing to seek deeper ties with the United States. — Reuters
TOKYO: Japanese chip-material maker Resonac says it will set up a research and development centre for advanced semiconductor packaging and materials in Silicon Valley.
The packaging stage of production is increasingly being seen as critical for driving advances in chip technology.
This week it kicked off a US$3bil programme to boost its packaging capabilities.
Resonac, formerly Showa Denko, is a leading manufacturer of materials for packaging such as films and plans to begin operations at its new centre in 2025.
Japanese chip sector firms are continuing to seek deeper ties with the United States.
Foundry venture Rapidus is planning to open a sales office there by the end of the current financial year. — Reuters
