AppAsia to explore collaboration in integrated circuit design

KUALA LUMPUR: AppAsia Bhd has entered into a memorandum of understanding (MoU) with CMSC Inc to explore the setting up of a joint special purpose venture entity to provide integrated circuit design in Malaysia.

In a filing with Bursa Malaysia, the group said the collaboration will include the provision of integrated circuit front-end design, back-end design and turnkey solutions.