PETALING JAYA: Antarabudaya Malaysia has launched the first AFS Global science, technology, engineering and mathematics (STEM) programmes for 2023 and scholarships for young Malaysians.
Antarabudaya Malaysia in a statement said the four-month intercultural programme combines digital and in-person learning.
The annual STEM scholarship program for 100 participants funded by global energy company, BP starts with a 12-week virtual e-learning curriculum, culminating with student-led social impact projects and presentations offering potential solutions to real-world challenges with emphasis on sustainability and the United Development Goals.
The topic of study includes climate change and energy transition.
“Upon successfully completing the virtual curriculum co-developed between AFS International and the University of Pennsylvania, the STEM scholars will travel on a 4-week immersive experience to one of the six participating AFS destinations: Brazil, China, Egypt, Europe, India, or the United States.
“They will also participate in community service and have the opportunity to visit local innovative, sustainability-focused operations to see first-hand how companies and organisations at the destination country use STEM skills to address industry and societal challenges around sustainability issues,” it said.
Board Trustee for AFS International and Advisor to Antarabudaya Malaysia, Datin Yasmin Merican, encouraged as many Malaysian youths as possible to send in their applications.
“The opportunity should not be missed as it affords an enriching intercultural learning experience for all the 10 Malaysian students selected,” she added.
The application is open to Malaysian citizens aged 15 to 17.5 years old (born between Nov 25, 2005 and March 25, 2008), able to participate fully both online and in-class settings, able to travel abroad and a few other requirements that can be viewed on https://www.afsmas.org/
Applications must be in before Jan 8, 2023.
Contact Sophie Ismail at 03-78876866 for more information on the programme.
