US announces $1.4 billion support for next-generation semiconductor advanced packaging

FILE PHOTO: Semiconductor chips are seen on a printed circuit board in this illustration picture taken February 17, 2023. REUTERS/Florence Lo/Illustration/File Photo

(Reuters) - The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.

(Reporting by Devika Nair in Bengaluru; editing by Jason Neely)